XCZU11EG-3FFVB1517I

AMD Xilinx XCZU11EG-3FFVB1517I

Part No:

XCZU11EG-3FFVB1517I

Manufacturer:

AMD Xilinx

Package:

-

AINNX NO:

69095974-XCZU11EG-3FFVB1517I

Description:

Description: Microprocessor Circuit, CMOS, PBGA1517, FCBGA-1517

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    1517
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Transferred
  • Ihs Manufacturer
    XILINX INC
  • Package Description
    BGA,
  • Date Of Intro
    2017-02-15
  • Moisture Sensitivity Levels
    4
  • Operating Temperature-Max
    100 °C
  • Operating Temperature-Min
    -40 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY
  • Supply Voltage-Nom
    0.9 V
  • JESD-609 Code
    e1
  • Terminal Finish
    TIN SILVER COPPER
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    S-PBGA-B1517
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Seated Height-Max
    3.51 mm
  • Length
    40 mm
  • Width
    40 mm
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