XCZU6CG-1SFVA625I

AMD Xilinx XCZU6CG-1SFVA625I

Part No:

XCZU6CG-1SFVA625I

Manufacturer:

AMD Xilinx

Package:

-

AINNX NO:

69808356-XCZU6CG-1SFVA625I

Description:

Description: Microprocessor Circuit, CMOS, PBGA625, BGA-625

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    625
  • Rohs Code
    Yes
  • Part Life Cycle Code
    Transferred
  • Ihs Manufacturer
    XILINX INC
  • Package Description
    FBGA, BGA625,25X25,32
  • Operating Temperature-Max
    100 °C
  • Operating Temperature-Min
    -40 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    FBGA
  • Package Equivalence Code
    BGA625,25X25,32
  • Package Shape
    SQUARE
  • Package Style
    GRID ARRAY, FINE PITCH
  • Supply Voltage-Max
    0.876 V
  • Supply Voltage-Min
    0.825 V
  • Supply Voltage-Nom
    0.85 V
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.31.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8 mm
  • Reach Compliance Code
    unknown
  • JESD-30 Code
    S-PBGA-B625
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • uPs/uCs/Peripheral ICs Type
    PROGRAMMABLE SoC
  • Seated Height-Max
    3.43 mm
  • Bus Compatibility
    I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2)
  • Length
    21 mm
  • Width
    21 mm
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