AMD XCZU5EV-1SFVC784E

Package / Case

784-BFBGA, FCBGA

Supplier Device Package

784-FCBGA (23x23)

Unit Weight

0.008466 oz

Factory Pack QuantityFactory Pack Quantity

250

Mounting Styles

PCB Mount

Manufacturer

TT Electronics

Brand

Welwyn Components / TT Electronics

RoHS

Details

Number of I/Os

252

Package

Tray

Base Product Number

XCZU5

Mfr

AMD

Product Status

Active

Series

RC

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Ammo Pack

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0°C ~ 100°C (TJ)

Subcategory

Resistors

Technology

Metal Film

Speed

500MHz, 600MHz, 1.2GHz

RAM Size

256KB

Core Processor

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

Peripherals

DMA, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Metal Film Resistors

Primary Attributes

Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

Flash Size

-

Product Category

a particular group of related products.

Metal Film Resistors - Through Hole