XCVM1302-1MLINSVF1369

AMD XCVM1302-1MLINSVF1369

Part No:

XCVM1302-1MLINSVF1369

Manufacturer:

AMD

Datasheet:

-

Package:

1369-BFBGA

AINNX NO:

68557827-XCVM1302-1MLINSVF1369

Description:

XCVM1302-1MLINSVF1369

Products specifications
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Gold
  • Package / Case
    1369-BFBGA
  • Supplier Device Package
    1369-BGA (35x35)
  • Termination Method
    Crimp
  • Wire Size
    26 AWG
  • Contact Materials
    Phosphor Bronze
  • Number of I/Os
    316
  • Package
    Tray
  • Mfr
    AMD
  • Product Status
    Active
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55 to 150 °C
  • Series
    Versal™ Prime
  • Gender
    Receptacle
  • Speed
    600MHz, 1.3GHz
  • RAM Size
    -
  • Cable Length

    A nautical unit of measure equal to one tenth of a nautical mile or approximately 1 fathoms.

    0.45 m
  • Core Processor
    Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
  • Peripherals
    DDR, DMA, PCIe
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MPU, FPGA
  • Primary Attributes
    Versal™ Prime FPGA, 70k Logic Cells
  • Flash Size
    -
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