XCZU47DR-L1FFVE1156I

AMD XCZU47DR-L1FFVE1156I

Part No:

XCZU47DR-L1FFVE1156I

Manufacturer:

AMD

Datasheet:

-

Package:

1156-BBGA, FCBGA

AINNX NO:

34101622-XCZU47DR-L1FFVE1156I

Description:

SoC 64-Bit ARM Cortex-A53/ARM Cortex-A5 RISC 500MHz/600MHz/1200MHz Hex Core 1156-Pin FCBGA

Products specifications
  • Package / Case
    1156-BBGA, FCBGA
  • Supplier Device Package
    1156-FCBGA (35x35)
  • Material
    Thermoplastic Rubber
  • Package Quantity
    4000
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    135 °C
  • Minimum Operating Temperature
    -40 °C
  • Inside Diameter
    12.5 mm
  • Number of I/Os
    366
  • Package
    Tray
  • Mfr
    AMD
  • Product Status
    Active
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 100°C (TJ)
  • Series
    Zynq® UltraScale+™ RFSoC
  • Type
    Hole Grommet
  • Color
    Black
  • Speed
    500MHz, 1.2GHz
  • RAM Size
    256KB
  • Core Processor
    Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Peripherals
    DMA, WDT
  • Connectivity
    CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Overall Height
    6.4 mm
  • Primary Attributes
    Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
  • Flash Size
    -
  • Panel Thickness
    1.6 mm
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