XC3S700A-4FTG256I

AMD XC3S700A-4FTG256I

Part No:

XC3S700A-4FTG256I

Manufacturer:

AMD

Datasheet:

-

Package:

SOD-123

AINNX NO:

40512301-XC3S700A-4FTG256I

Description:

FPGA Spartan-3A Family 700K Gates 13248 Cells 667MHz 90nm Technology 1.2V 256-Pin FTBGA

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    SOD-123
  • Supplier Device Package
    SOD-123
  • Impedance (Max) (Zzt)
    250 Ohms
  • Number of I/Os
    161
  • Package
    Tray
  • Base Product Number
    XC3S700
  • Mfr
    AMD
  • Product Status
    Active
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 150°C
  • Series
    Automotive, AEC-Q101
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Tolerance
    ±5%
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Voltage - Supply
    1.14V ~ 1.26V
  • Power - Max
    410mW
  • Voltage - Zener (Nom) (Vz)
    75V
  • Number of Logic Elements/Cells
    13248
  • Total RAM Bits
    368640
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    700000
  • Number of LABs/CLBs
    1472
  • Speed Grade
    4
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