AMD XC3S400-4FTG256C

Mounting Type

Surface Mount

Package / Case

DO-213AA (Glass)

Supplier Device Package

DO-213AA (GL34)

Number of I/Os

173

Package

Tray

Base Product Number

XC3S400

Mfr

AMD

Product Status

Active

Series

SUPERECTIFIER®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0°C ~ 85°C (TJ)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Voltage - Supply

1.14V ~ 1.26V

Base Part Number

BYM07-100

Speed

Fast Recovery = 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

5µA @ 100V

Voltage - Forward (Vf) (Max) @ If

1.25V @ 500mA

Operating Temperature - Junction

-65°C ~ 175°C

Voltage - DC Reverse (Vr) (Max)

100V

Current - Average Rectified (Io)

500mA

Number of Logic Elements/Cells

8064

Total RAM Bits

294912

Capacitance @ Vr, F

7pF @ 4V, 1MHz

Number of Gates

The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

400000

Number of LABs/CLBs

896

Speed Grade

4

Reverse Recovery Time (trr)

50ns