EPC1213PI8

ALTERA EPC1213PI8

Part No:

EPC1213PI8

Manufacturer:

ALTERA

Datasheet:

-

Package:

8-DIP (0.300, 7.62mm)

AINNX NO:

47996468-EPC1213PI8

Description:

IC CONFIG DEVICE 212KBIT 8DIP

Products specifications
  • Package / Case
    8-DIP (0.300, 7.62mm)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Supplier Device Package
    8-PDIP
  • Number of Terminals
    8
  • Package Description
    DIP, DIP8,.3
  • Package Style
    IN-LINE
  • Moisture Sensitivity Levels
    1
  • Number of Words Code
    212942
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    DIP8,.3
  • Operating Temperature-Min
    -40 °C
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Access Time-Max
    75 ns
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    EPC1213PI8
  • Clock Frequency-Max (fCLK)
    6 MHz
  • Number of Words
    212942 words
  • Supply Voltage-Nom (Vsup)
    5 V
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Intel Corporation
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    INTEL CORP
  • Risk Rank
    5.65
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C
  • Series
    EPC
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • JESD-609 Code
    e0
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.61
  • Subcategory
    OTP ROMs
  • Technology
    CMOS
  • Voltage - Supply
    4.5 V ~ 5.5 V
  • Terminal Position
    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54 mm
  • Reach Compliance Code
    compliant
  • Base Part Number
    EPC1213
  • JESD-30 Code
    R-PDIP-T8
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Programmable Type

    These include Field Programmable Logic Devices (FPGAs), Complex Programmable Logic Devices (CPLD) and Programmable Logic Devices (PLD, PLA, PAL, GAL). There are also devices that are the analog equivalent of these called field programmable analog arrays.

    OTP
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    212kb
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Supply Current-Max
    0.05 mA
  • Organization
    212942X1
  • Output Characteristics
    3-STATE
  • Seated Height-Max
    4.318 mm
  • Memory Width
    1
  • Standby Current-Max
    0.0002 A
  • Memory Density
    212942 bit
  • Parallel/Serial
    SERIAL
  • I/O Type
    COMMON
  • Memory IC Type
    CONFIGURATION MEMORY
  • Width
    7.62 mm
  • Length
    9.398 mm
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