EPC1064LI20

ALTERA EPC1064LI20

Part No:

EPC1064LI20

Manufacturer:

ALTERA

Datasheet:

-

Package:

20-LCC (J-Lead)

AINNX NO:

38161894-EPC1064LI20

Description:

IC CONFIG DEVICE 65KBIT 20PLCC

Products specifications
  • Package / Case
    20-LCC (J-Lead)
  • Mounting Type
    Surface Mount
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Supplier Device Package
    20-PLCC (9x9)
  • Number of Terminals
    20
  • Connections
    -
  • Manufacturer part #
    933 137-100-1
  • Contamination level
    3
  • Nominal voltage (details)
    250V
  • Content
    1pc(s)
  • Total no. of pins
    2
  • Pins
    2 + PE
  • Nominal current (details)
    4A
  • Factory colour
    Black
  • Package
    Tube
  • Mfr
    Altera
  • Product Status
    Obsolete
  • Package Description
    PLASTIC, LCC-20
  • Package Style
    CHIP CARRIER
  • Moisture Sensitivity Levels
    1
  • Number of Words Code
    64000
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Min
    -40 °C
  • Reflow Temperature-Max (s)
    30
  • Operating Temperature-Max
    85 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    EPC1064LI20
  • Clock Frequency-Max (fCLK)
    4 MHz
  • Number of Words
    65536 words
  • Supply Voltage-Nom (Vsup)
    5 V
  • Package Code
    QCCJ
  • Package Shape
    SQUARE
  • Manufacturer
    Rochester Electronics LLC
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    ROCHESTER ELECTRONICS LLC
  • Risk Rank
    5.8
  • Part Package Code
    QLCC
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 85°C
  • Series
    EPC
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • JESD-609 Code
    e0
  • Pbfree Code
    No
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Type
    GDSN 207
  • Terminal Finish
    TIN LEAD
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    4 WIRE INTERFACE TO FLEX 8000 DEVICES
  • Technology
    MOS
  • Voltage - Supply
    4.5 V ~ 5.5 V
  • Terminal Position
    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    J BEND
  • Peak Reflow Temperature (Cel)
    220
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    1.27 mm
  • Reach Compliance Code
    unknown
  • Base Part Number
    EPC1064
  • Pin Count

    a count of all of the component leads (or pins)

    20
  • JESD-30 Code
    S-PQCC-J20
  • Qualification Status

    An indicator of formal certification of qualifications.

    COMMERCIAL
  • Supply Voltage-Max (Vsup)
    5.5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    4.5 V
  • Programmable Type

    These include Field Programmable Logic Devices (FPGAs), Complex Programmable Logic Devices (CPLD) and Programmable Logic Devices (PLD, PLA, PAL, GAL). There are also devices that are the analog equivalent of these called field programmable analog arrays.

    OTP
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    65kb
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Organization
    64KX1
  • Seated Height-Max
    4.572 mm
  • Memory Width
    1
  • Memory Density
    65536 bit
  • Parallel/Serial
    SERIAL
  • Memory IC Type
    CONFIGURATION MEMORY
  • Width
    8.9662 mm
  • Length
    8.9662 mm
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