10AS048E1F29I1SG

ALTERA 10AS048E1F29I1SG

Part No:

10AS048E1F29I1SG

Manufacturer:

ALTERA

Datasheet:

-

Package:

2010 (5025 Metric)

AINNX NO:

40541055-10AS048E1F29I1SG

Description:

IC SOC FPGA 360 I/O 780FBGA

Products specifications
  • Package / Case
    2010 (5025 Metric)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Supplier Device Package
    2010
  • Number of Terminals
    780
  • Package
    Tape & Reel (TR)
  • Mfr
    Kamaya Inc.
  • Product Status
    Active
  • Number of I/Os
    360
  • Package Description
    29 X 29 MM, ROHS COMPLIANT, FBGA-780
  • Package Style
    GRID ARRAY
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Min
    -40 °C
  • Supply Voltage-Nom
    0.9 V
  • Supply Voltage-Min
    0.87 V
  • Operating Temperature-Max
    100 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    10AS048E1F29I1SG
  • Package Code
    BGA
  • Package Shape
    SQUARE
  • Manufacturer
    Intel Corporation
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    INTEL CORP
  • Supply Voltage-Max
    0.93 V
  • Risk Rank
    5.68
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 155°C
  • Series
    RMC
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Size / Dimension
    0.197 L x 0.098 W (5.00mm x 2.50mm)
  • Tolerance
    ±1%
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Discontinued at Digi-Key
  • Number of Terminations
    2
  • Temperature Coefficient

    The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

    ±100ppm/°C
  • Resistance
    2.32 kOhms
  • Composition
    Thick Film
  • Power (Watts)
    0.75W, 3/4W
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    S-PBGA-B780
  • Failure Rate

    the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

    -
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Speed
    1.5GHz
  • RAM Size
    256KB
  • Core Processor
    Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Peripherals
    DMA, POR, WDT
  • Connectivity
    EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Architecture
    MCU, FPGA
  • Seated Height-Max
    3.35 mm
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Primary Attributes
    FPGA - 480K Logic Elements
  • Flash Size
    --
  • Features
    -
  • Height Seated (Max)
    0.028 (0.70mm)
  • Width
    29 mm
  • Length
    29 mm
  • Ratings
    -
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