ALTERA 5ASXBB3D4F31I5N

Package / Case

896-BBGA, FCBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

896-FBGA (31x31)

Number of Terminals

896

Number of I/Os

MCU - 208, FPGA - 250

Package Description

FBGA-896

Package Style

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA896,30X30,40

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

1.1 V

Reflow Temperature-Max (s)

NOT SPECIFIED

Supply Voltage-Min

1.07 V

Operating Temperature-Max

100 °C

Rohs Code

Yes

Manufacturer Part Number

5ASXBB3D4F31I5N

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

End Of Life

Ihs Manufacturer

INTEL CORP

Supply Voltage-Max

1.13 V

Risk Rank

5.28

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 100°C (TJ)

Series

Arria V SX

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

JESD-609 Code

e1

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Terminal Finish

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

compliant

Base Part Number

5ASXBB3

JESD-30 Code

S-PBGA-B896

Number of Outputs

250

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Speed

800MHz

RAM Size

64KB

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

Number of Inputs

250

Organization

13207 CLBS

Seated Height-Max

2.7 mm

Programmable Logic Type

Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes

FPGA - 350K Logic Elements

Number of CLBs

13207

Number of Logic Cells

An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

350000

Flash Size

--

Width

31 mm

Length

31 mm