ALTERA 10AS032E2F27I1SG

Package / Case

672-BBGA, FCBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

672-FBGA (27x27)

Number of Terminals

672

Package

Bulk

Mfr

PEI-Genesis

Product Status

Active

Number of I/Os

240

RoHS

Non-Compliant

Package Description

27 X 27 MM, ROHS COMPLIANT, FBGA-672

Package Style

GRID ARRAY

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Supply Voltage-Nom

0.9 V

Supply Voltage-Min

0.87 V

Operating Temperature-Max

100 °C

Rohs Code

Yes

Manufacturer Part Number

10AS032E2F27I1SG

Package Code

BGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

Obsolete

Ihs Manufacturer

INTEL CORP

Supply Voltage-Max

0.93 V

Risk Rank

5.66

Series

*

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-40°C ~ 100°C (TJ)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Discontinued at Digi-Key

HTS Code

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

8542.39.00.01

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Terminal Pitch

The center distance from one pole to the next.

1 mm

Reach Compliance Code

compliant

JESD-30 Code

S-PBGA-B672

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Speed

1.5GHz

RAM Size

256KB

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA, POR, WDT

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

Seated Height-Max

3.25 mm

Programmable Logic Type

Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes

FPGA - 320K Logic Elements

Flash Size

--

Width

27 mm

Length

27 mm