ALTERA 5CSEBA5U19C7SN

Package / Case

484-FBGA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Supplier Device Package

484-UBGA (19x19)

Number of Terminals

484

Number of I/Os

MCU - 151, FPGA - 66

Package Description

FBGA, BGA484,22X22,32

Package Style

GRID ARRAY, FINE PITCH

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

BGA484,22X22,32

Supply Voltage-Nom

1.1 V

Reflow Temperature-Max (s)

NOT SPECIFIED

Supply Voltage-Min

1.07 V

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

5CSEBA5U19C7SN

Package Code

FBGA

Package Shape

SQUARE

Manufacturer

Intel Corporation

Part Life Cycle Code

Active

Ihs Manufacturer

INTEL CORP

Supply Voltage-Max

1.13 V

Risk Rank

5.55

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0°C ~ 85°C (TJ)

Series

Cyclone® V SE

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Subcategory

Field Programmable Gate Arrays

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

Base Part Number

5CSEBA5

JESD-30 Code

S-PBGA-B484

Number of Outputs

66

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

1.1,1.2/3.3,2.5 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

OTHER

Speed

800MHz

RAM Size

64KB

Core Processor

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA, POR, WDT

Connectivity

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Architecture

MCU, FPGA

Number of Inputs

66

Seated Height-Max

1.9 mm

Programmable Logic Type

Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes

FPGA - 85K Logic Elements

Number of Logic Cells

An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

85000

Flash Size

--

Width

19 mm

Length

19 mm