ALTERA 10AS016E4F27E3SG

Package / Case

672-BBGA, FCBGA

Supplier Device Package

672-FBGA (27x27)

Material

Silicone, Ceramic Filled

Shape

Square

Package

Bulk

Base Product Number

A17883

Mfr

Laird Technologies - Thermal Materials

Product Status

Active

Number of I/Os

240

RoHS

Non-Compliant

Moisture Sensitive

Yes

L1 Cache Instruction Memory

2 x 32 kB

Maximum Clock Frequency

1.2 GHz

Number of Logic Elements

160000 LE

Factory Pack QuantityFactory Pack Quantity

1

Mounting Styles

SMD/SMT

Number of Logic Array Blocks - LABs

20000 LAB

Part # Aliases

964702

Manufacturer

Intel

Brand

Intel / Altera

Tradename

Arria 10 SoC

L1 Cache Data Memory

2 x 32 kB

Data RAM Size

-

Series

Tflex™ HD80000

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0°C ~ 100°C (TJ)

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Gap Filler Pad, Sheet

Color

Teal

Subcategory

SOC - Systems on a Chip

Speed

1.5GHz

RAM Size

256KB

Core Processor

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

Peripherals

DMA, POR, WDT

Program Memory Size

-

Connectivity

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Usage

-

Architecture

MCU, FPGA

Shelf Life

12 Months

Adhesive

-

Storage/Refrigeration Temperature

32°F ~ 95°F (0°C ~ 35°C)

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

SoC FPGA

Shelf Life Start

Date of Certification

Backing, Carrier

-

Outline

228.60mm x 228.60mm

Primary Attributes

FPGA - 160K Logic Elements

Thermal Conductivity

a measure of a material's ability to?conduct heat.?

6.0W/m-K

Number of Cores

2 Core

Flash Size

--

Thermal Resistivity

Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance.

-

Product Category

a particular group of related products.

SoC FPGA

Thickness

0.150 (3.81mm)