Alliance Memory, Inc. AS4C8M32MD2A-25BCNTR

Factory Lead Time

10 Weeks

Mounting Type

Surface Mount

Package / Case

134-TFBGA

Supplier Device Package

134-FBGA (10x11.5)

Manufacturer Part Number

AS4C8M32MD2A-25BCNTR

Rohs Code

Yes

Part Life Cycle Code

Active

Ihs Manufacturer

ALLIANCE MEMORY INC

Risk Rank

5.66

Reflow Temperature-Max (s)

NOT SPECIFIED

Moisture Sensitive

Yes

Maximum Clock Frequency

400 MHz

Maximum Operating Temperature

the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

+ 85 C

Supply Voltage-Max

1.95 V

Minimum Operating Temperature

- 25 C

Factory Pack QuantityFactory Pack Quantity

1000

Supply Voltage-Min

1.14 V

Mounting Styles

SMD/SMT

Brand

Alliance Memory

RoHS

Details

Package

Tape & Reel (TR)

Mfr

Alliance Memory, Inc.

Product Status

Active

Memory Types

Volatile

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Reel

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

-25°C ~ 85°C (TC)

Series

-

Type

SDRAM Mobile - LPDDR2

Subcategory

Memory & Data Storage

Technology

SDRAM - Mobile LPDDR2

Voltage - Supply

1.14V ~ 1.3V, 1.7V ~ 1.95V

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Reach Compliance Code

compliant

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

256Mbit

Clock Frequency

400 MHz

Supply Current-Max

140 mA

Access Time

5.5 ns

Memory Format

DRAM

Memory Interface

An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

HSUL_12

Data Bus Width

32 bit

Organization

8 M x 32

Write Cycle Time - Word, Page

15ns

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

DRAM

Memory IC Type

SYNCHRONOUS DRAM

Product Category

a particular group of related products.

DRAM

Memory Organization

8M x 32