AS4C32M16MS-6BIN
FBGA-54
32740274-AS4C32M16MS-6BIN
DRAM 512M 1.8V 166MHz 32Mx16 LP MSDR
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
The center distance from one pole to the next.
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
The memory capacity is the amount of data a device can store at any given time in its memory.
A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.
A phase of operation during the operation and maintenance stages of the life cycle of a facility.
a group of products which fulfill a similar need for a market segment or market as a whole.
Distinct operation recognized by the protection mechanisms as a possible operation on an object.
a particular group of related products.