AS4C32M16MS-6BIN

Alliance Memory, Inc. AS4C32M16MS-6BIN

Part No:

AS4C32M16MS-6BIN

Datasheet:

-

Package:

FBGA-54

AINNX NO:

32740274-AS4C32M16MS-6BIN

Description:

DRAM 512M 1.8V 166MHz 32Mx16 LP MSDR

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Package / Case
    FBGA-54
  • Number of Terminals
    54
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    VFBGA
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY, VERY THIN PROFILE, FINE PITCH
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Moisture Sensitive
    Yes
  • Maximum Clock Frequency
    166 MHz
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 85 C
  • Supply Voltage-Max
    1.95 V
  • Minimum Operating Temperature
    - 40 C
  • Factory Pack QuantityFactory Pack Quantity
    264
  • Supply Voltage-Min
    1.7 V
  • Mounting Styles
    SMD/SMT
  • Brand
    Alliance Memory
  • RoHS
    Details
  • Manufacturer Part Number
    AS4C32M16MS-6BIN
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    ALLIANCE MEMORY INC
  • Package Description
    VFBGA,
  • Risk Rank
    8.28
  • Access Time-Max
    5 ns
  • Number of Words
    33554432 words
  • Number of Words Code
    32000000
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -40 °C
  • Series
    AS4C32M16MS
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Type
    SDRAM Mobile
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    AUTO/SELF REFRESH
  • Subcategory
    Memory & Data Storage
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.8 mm
  • Reach Compliance Code
    compliant
  • JESD-30 Code
    R-PBGA-B54
  • Supply Voltage-Max (Vsup)
    1.95 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    512 Mbit
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Supply Current-Max
    50 mA
  • Access Time
    5 ns
  • Data Bus Width
    16 bit
  • Organization
    32MX16
  • Seated Height-Max
    1 mm
  • Memory Width
    16
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    DRAM
  • Memory Density
    536870912 bit
  • Memory IC Type
    SYNCHRONOUS DRAM
  • Access Mode

    Distinct operation recognized by the protection mechanisms as a possible operation on an object.

    FOUR BANK PAGE BURST
  • Self Refresh
    YES
  • Product Category

    a particular group of related products.

    DRAM
  • Width
    8 mm
  • Length
    9 mm
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