AGASTAT 5-583294-2

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Contact Materials

Phosphor Bronze

Series

Amp-Leaf

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Contact Finish

Gold

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

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Contact Termination

Solder

Pin or Socket

Non-Gendered

Contact Finish Thickness

15.0µin (0.38µm)