AGASTAT 5-530518-1

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

5-530518-1-ND A122638

Contact Materials

Copper Alloy

Series

-

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Contact Finish

Tin

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

14-16 AWG

Contact Termination

Crimp

Pin or Socket

Non-Gendered

Contact Finish Thickness

15.0µin (0.38µm)