AGASTAT 50990

Mounting Type

Surface Mount

Package / Case

DO-219AB

Supplier Device Package

DO-219AB (SMF)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Contact Materials

Copper

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Crimp, Barrel

Color

-

Contact Finish

Tin

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

2/0 AWG

Speed

Standard Recovery >500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

10µA @ 100V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 1A

Operating Temperature - Junction

-55°C ~ 150°C

Voltage - DC Reverse (Vr) (Max)

100V

Current - Average Rectified (Io)

700mA

Insulation

Non-Insulated

Terminal Type

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

Rectangular Tongue

Capacitance @ Vr, F

4pF @ 4V, 1MHz

Stud/Tab Size

5/16 Stud

Terminal Style

Two Stud Holes

Reverse Recovery Time (trr)

1.8µs

Features

-

Length - Overall

3.020 (76.71mm)

Width - Outer Edges

0.970 (24.64mm)

Tab Thickness

0.110 (2.79mm)

Diameter - Barrel ID

0.513 (13.03mm)

Diameter - Barrel OD

0.646 (16.41mm)

Diameter - Ring ID

0.328 (8.33mm)