AGASTAT 1527347-3

Mounting Type

Surface Mount

Package / Case

DO-219AB

Supplier Device Package

DO-219AB (SMF)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Contact Materials

Copper

Series

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Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Termination

Crimp, Barrel

Color

Blue

Contact Finish

Tin

Wire Gauge

a measurement of?wire?diameter.?This determines the amount of electric current the wire can safely carry, as well as its electrical resistance and weight.

6 AWG

Speed

Standard Recovery >500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

10µA @ 200V

Voltage - Forward (Vf) (Max) @ If

1.1V @ 1A

Operating Temperature - Junction

-55°C ~ 150°C

Voltage - DC Reverse (Vr) (Max)

200V

Current - Average Rectified (Io)

700mA

Insulation

Non-Insulated

Terminal Type

Terminal type or emulation specifies how your computer and the host computer to which you are connected exchange information.

Ring, Tubular

Capacitance @ Vr, F

4pF @ 4V, 1MHz

Stud/Tab Size

1/4 Stud

Terminal Style

Single Stud Hole

Reverse Recovery Time (trr)

1.8µs

Features

Heavy Duty

Length - Overall

2.300 (58.42mm)

Width - Outer Edges

0.400 (10.16mm)

Tab Thickness

0.078 (1.98mm)

Diameter - Barrel ID

0.204 (5.18mm)

Diameter - Barrel OD

0.282 (7.16mm)

Diameter - Ring ID

0.275 (6.99mm)