Advanced Thermal Solutions, Inc. ATS-EXL117-1220-R0

Material

Aluminum

Shape

Rectangular, Fins

Package Cooled

-

Material Finish

Degreased

RoHS

Details

Designed for

-

Heatsink Material

Aluminum

Fin Style

Extruded Radial Fin

Height - mm

12 mm

Length - mm

1220 mm

Factory Pack QuantityFactory Pack Quantity

1

Width - mm

233 mm

Package

Bulk

Base Product Number

ATS-EXL

Mfr

Advanced Thermal Solutions Inc.

Product Status

Active

Series

ATS-EXL

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Box

Type

Top Mount, Extrusion

Attachment Method

Adhesive

Thermal Resistance @ Forced Air Flow

1.10°C/W @ 200 LFM

Thermal Resistance @ Natural

6.90°C/W

Power Dissipation @ Temperature Rise

-

Product

Extrusions

Thermal Resistance

Thermal resistance is defined as the ratio of the temperature difference between the two faces of a material to the rate of heat flow per unit area. Thermal resistance determines the heat insulation property of a textile material. The higher the thermal resistance, the lower is the heat loss.

1.1 C/W

Length

1220 mm

Width

233 mm

Height

12 mm

Diameter

-