Advanced Thermal Solutions Inc. ATS-56005-C4-R0

Factory Lead Time

6 Weeks

Mount

Adhesive

Material

Aluminum

Shape

Rectangular, Angled Fins

Package Cooled

ASIC

Material Finish

Black Anodized

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

maxiFLOW

Published

2007

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Type

Top Mount

Color

Black

Depth

45mm

Attachment Method

Thermal Tape, Adhesive (Not Included)

Height Off Base (Height of Fin)

0.590 15.00mm

Thermal Resistance @ Forced Air Flow

2.80°C/W @ 200 LFM

Height

15mm

Length

1.969 50.00mm

Width

1.772 45.00mm

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free