Aavid, Thermal Division of Boyd Corporation 8180-E1

Mount

Through Hole

Mounting Type

Through Hole

Package / Case

TO-3

Number of Pins

4

Housing Material

Polyamide (PA), Nylon, Glass Filled

Number of Positions or Pins (Grid)

4 (Oval)

Contact Material - Mating

Steel

Contact Finish Mating

Tin

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

8180

Published

2000

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

Not Applicable

Termination

Solder

Type

Transistor, TO-3

Features

Closed Frame

Length

10.03mm

Material Flammability Rating

UL94 V-0

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Non-RoHS Compliant