8114LB603 REV J

Aavid, Thermal Division of Boyd Corporation 8114LB603 REV J

Part No:

8114LB603 REV J

Datasheet:

8114LB603

Package:

-

AINNX NO:

4992035-8114LB603 REV J

Description:

CONN TRANSIST TO-3 4POS TIN

Products specifications
  • Factory Lead Time
    9 Weeks
  • Mounting Type
    Through Hole
  • Housing Material
    Phenolic
  • Number of Positions or Pins (Grid)
    4 (Oval)
  • Contact Material - Mating
    Brass
  • Contact Finish Mating
    Tin
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Series
    8180
  • Published
    2001
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    Not Applicable
  • Termination
    Solder
  • Type
    Transistor, TO-3
  • Features
    Closed Frame
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
0 Similar Products Remaining
Documents & Media Download datasheets and manufacturer documentation for Aavid, Thermal Division of Boyd Corporation 8114LB603 REV J.