XP9565BGH

YAGEO XSEMI XP9565BGH

Part No:

XP9565BGH

Manufacturer:

YAGEO XSEMI

Datasheet:

XP9565BGH.pdf

Package:

TO-252-3, DPAK (2 Leads + Tab), SC-63

AINNX NO:

69209701-XP9565BGH

Description:

MOSFET P-CH 40V 17A TO252

Products specifications
  • Mounting Type
    Surface Mount
  • Package / Case
    TO-252-3, DPAK (2 Leads + Tab), SC-63
  • Supplier Device Package
    TO-252
  • Mfr
    YAGEO XSEMI
  • Current - Continuous Drain (Id) @ 25℃
    17A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On)
    4.5V, 10V
  • Power Dissipation (Max)
    25W (Tc)
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -55°C ~ 150°C (TJ)
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • FET Type
    P-Channel
  • Rds On (Max) @ Id, Vgs
    52mOhm @ 8A, 10V
  • Vgs(th) (Max) @ Id
    3V @ 250µA
  • Input Capacitance (Ciss) (Max) @ Vds
    850 pF @ 25 V
  • Gate Charge (Qg) (Max) @ Vgs
    12.5 nC @ 4.5 V
  • Drain to Source Voltage (Vdss)
    40 V
  • Vgs (Max)
    ±20V
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