HC6666000000SB000

YAGEO HC6666000000SB000

Part No:

HC6666000000SB000

Manufacturer:

YAGEO

Datasheet:

-

Package:

-

AINNX NO:

70156770-HC6666000000SB000

Description:

KIT MLCC HI-CAP X6S

Products specifications
  • Mounting Type
    Surface Mount, MLCC
  • Packages Included
    0201, 0402, 0603, 0805 (0603, 1005, 1608, 2012 Metric)
  • Voltage Rated

    RATED voltage is the voltage on the nameplate - the "design point" for maximum power throughput and safe thermal operation.

    4 ~ 25V
  • Series
    CC
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Case
  • Tolerance
    ±10%, ±20%
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Quantity
    22 Pieces (Assorted Per Value)
  • Kit Type
    Ceramic
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