XMOS XU216-512-FB236-C20

Factory Lead Time

12 Weeks

Mounting Type

Surface Mount

Package / Case

236-LFBGA

Number of Pins

236

Supplier Device Package

236-FBGA (10x10)

Memory Types

ROMless

Number of I/Os

104

Operating Temperature

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

0°C~70°C TA

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Series

XU

Published

2015

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

3 (168 Hours)

Max Operating Temperature

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

70°C

Min Operating Temperature

0°C

Interface

USB

Oscillator Type

Wien Bridge Oscillator; RC Phase Shift Oscillator; Hartley Oscillator; Voltage Controlled Oscillator; Colpitts Oscillator; Clapp Oscillators; Crystal Oscillators; Armstrong Oscillator.

External

Speed

2000MIPS

RAM Size

512K x 8

Voltage - Supply (Vcc/Vdd)

0.95V~3.6V

Core Processor

XCore

Program Memory Type

Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

ROMless

Core Size

32-Bit 16-Core

Connectivity

USB

Core Architecture

XCore

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant