XKB CONNECTIVITY XKSIM-115

Weight

2.365

Overall Dimension

W26.50XD19.35XH2.15

Height from mounting surface (mm)

2.15

Soldering Temp (Max)

260°C

Name

#REF!

Contact Materials

Copper alloys

Conntact Coatings

Gold plated

Package Specifications

SMD

Maximum Self Height

2.2mm

Connecting Mode

Self-ejecting

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Pin Count

a count of all of the component leads (or pins)

8

Card Type

MicroSIM卡