XKB Connectivity X9635WV-03H-N2SN

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Production Status

Active

MPQ

0

Mounting

Through-hole Mount

Operation

Vertical

Jack Structure

1x03

Number of Pins/Row

3

Package specification

DIP,P=6.35

Reference Series

AMP2.1

Contact Materials

Brass

With latch

Yes

Pin structure

1x03

Series

Wire to board 6.35-X9635

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bag

Connector Type

Female Socket

Color

White

Number of rows

Single row

Pitch

6.35mm

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

Wire-to-Wire Connector

Industry Standards

UL/CUL-E523734