XKB Connectivity X9127HI-22-PTSN

Contact Plating

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

Tin

Production Status

Active

MPQ

19 pieces/tube

Mounting

Insulation Displacement

Additional Description

Line to board/line to line connector

Jack Structure

1x22

Number of Pins/Row

22

Package specification

DIP, P=1.27mm (staggered feet)

Contact Materials

Brass

With latch

No

Series

Pair board 1.27-X9127

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Connector Type

Male Socket

Number of rows

Single row

Pitch

1.27mm

Product Type

a group of products which fulfill a similar need for a market segment or market as a whole.

IDC Connector

Industry Standards

UL/CUL-E523734