X3025WV-2X04H-LPSN

XKB Connectivity X3025WV-2X04H-LPSN

Part No:

X3025WV-2X04H-LPSN

Manufacturer:

XKB Connectivity

Datasheet:

-

Package:

-

AINNX NO:

68687350-X3025WV-2X04H-LPSN

Description:

Products specifications
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Package specification
    DIP,P=3.0mm
  • Reference Series
    MX 3.0
  • Contact Materials
    Brass
  • With latch
    Yes
  • Number of Pins/Row
    4
  • Jack Structure
    2x04
  • Operation
    Vertical
  • Mounting
    Through-hole Mount
  • MPQ
    0
  • Production Status
    Active
  • Product PIN Number
    8
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    Pair board 3.0-X3025
  • Connector Type
    Female Socket
  • Color
    Black
  • Pitch
    3.0mm
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Wire-to-Wire Connector
  • Industry Standards
    UL/CUL-E523734
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