XC2V6000-5FFG1152I

Xilinx Inc. XC2V6000-5FFG1152I

Part No:

XC2V6000-5FFG1152I

Manufacturer:

Xilinx Inc.

Package:

1152-BBGA, FCBGA

ROHS:

AINNX NO:

7566926-XC2V6000-5FFG1152I

Description:

IC FPGA 824 I/O 1152FCBGA

Products specifications
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    1152-BBGA, FCBGA
  • Number of Pins
    1152
  • Number of I/Os
    824
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~100°C TJ
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Series
    Virtex®-II
  • Published
    2007
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)
    4 (72 Hours)
  • ECCN Code
    EAR99
  • Voltage - Supply
    1.425V~1.575V
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    1.5V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Time@Peak Reflow Temperature-Max (s)
    30
  • Base Part Number
    XC2V6000
  • Number of Outputs
    824
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.5V
  • RAM Size
    324kB
  • Programmable Logic Type

    Generally, programmable logic devices can be described as being one of three different types: Simple programmable logic devices (SPLD) Complex programmable logic devices (CPLD) Field programmable logic devices (FPGA).

    FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
    2654208
  • Number of Gates

    The number of gates per IC varies depending on the number of inputs per gate. Two?input gates are common, but if only a single input is required, such as in the 744 NOT(or inverter) gates, a 14 pin IC can accommodate 6 (or Hex) gates.

    6000000
  • Number of LABs/CLBs
    8448
  • Speed Grade
    5
  • Number of Registers
    67584
  • Combinatorial Delay of a CLB-Max
    0.39 ns
  • Number of Logic Cells

    An FPGA contains a large number of logic cells. Each logic cell can be configured to implement a certain set of functions. Each logic cell has a fixed number of inputs and outputs. Flip-flop can be incorporated into a multiplexer-based logic module to implement sequential logic.

    76032
  • Height Seated (Max)
    3.4mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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