Xilinx Inc. EK-K7-KC705-G

Factory Lead Time

10 Weeks

Memory Types

DDR3

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

Kintex-7

Published

2012

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

FPGA

Memory Size

The memory capacity is the amount of data a device can store at any given time in its memory.

1GB

Evaluation Kit

Yes

Core Architecture

FPGA

Contents

Board(s), Cable(s), Power Supply

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant