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Xilinx XC1701LPC20I
XC1701LPC20I
-
23852786-XC1701LPC20I
Configuration Memory, 1MX1, Serial, CMOS, PQCC20, PLASTIC, LCC-20
- Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
YES - Number of Terminals20
- PackageBulk
- MfrAMD Xilinx
- Product StatusActive
- Package DescriptionPLASTIC, LCC-20
- Package StyleCHIP CARRIER
- Moisture Sensitivity Levels3
- Number of Words Code1000000
- Package Body MaterialPLASTIC/EPOXY
- Operating Temperature-Min-40 °C
- Reflow Temperature-Max (s)30
- Operating Temperature-Max85 °C
- Rohs CodeNo
- Manufacturer Part NumberXC1701LPC20I
- Number of Words1048576 words
- Supply Voltage-Nom (Vsup)3.3 V
- Package CodeQCCJ
- Package ShapeSQUARE
- ManufacturerRochester Electronics LLC
- Part Life Cycle CodeActive
- Ihs ManufacturerROCHESTER ELECTRONICS LLC
- Risk Rank5.79
- Part Package CodeQLCC
- Series*
- JESD-609 Codee0
- Pbfree CodeNo
- Terminal FinishTIN LEAD
- Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS - TechnologyCMOS
- Terminal PositionQUAD
- Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
J BEND - Peak Reflow Temperature (Cel)225
- Number of Functions1
- Terminal Pitch
The center distance from one pole to the next.
1.27 mm - Reach Compliance Codeunknown
- Pin Count
a count of all of the component leads (or pins)
20 - JESD-30 CodeS-PQCC-J20
- Qualification Status
An indicator of formal certification of qualifications.
COMMERCIAL - Supply Voltage-Max (Vsup)3.6 V
- Temperature Grade
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
INDUSTRIAL - Supply Voltage-Min (Vsup)3 V
- Operating Mode
A phase of operation during the operation and maintenance stages of the life cycle of a facility.
SYNCHRONOUS - Organization1MX1
- Seated Height-Max4.572 mm
- Memory Width1
- Memory Density1048576 bit
- Parallel/SerialSERIAL
- Memory IC TypeCONFIGURATION MEMORY
- Width8.9662 mm
- Length8.9662 mm
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