World Products P6SMBJ20CA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Pins

5

Diode Element Material

SILICON

Number of Terminals

2

RoHS

Compliant

Package Style

SMALL OUTLINE

Package Body Material

PLASTIC/EPOXY

Power Dissipation (Max)

5

Package Shape

RECTANGULAR

Number of Elements

1

Breakdown Voltage-Nom

23.85

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

JESD-609 Code

e0

Termination

IDT

Connector Type

Connector, IDC

Terminal Finish

TIN LEAD

Additional Feature

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

UL RECOGNIZED

Technology

AVALANCHE

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

C BEND

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Time@Peak Reflow Temperature-Max (s)

NOT SPECIFIED

JESD-30 Code

R-PDSO-C2

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Polarity

BIDIRECTIONAL

Configuration

SINGLE

Wire/Cable Type

Flat Flex

Diode Type

TRANS VOLTAGE SUPPRESSOR DIODE

Cable Length

A nautical unit of measure equal to one tenth of a nautical mile or approximately 1 fathoms.

497 mm

Rep Pk Reverse Voltage-Max

20

JEDEC-95 Code

DO-214AA

Non-rep Peak Rev Power Dis-Max

600

Breakdown Voltage-Min

22.2

Clamping Voltage-Max

32.4

Breakdown Voltage-Max

25.5

Radiation Hardening

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

No