Wiremold 436-2-2

Material

Aluminum

Shape

Square, Fins

Package Cooled

Assorted (BGA, LGA, CPU, ASIC...)

Material Finish

Blue Anodized

Unit Weight

5 oz

Factory Pack QuantityFactory Pack Quantity

1

Part # Aliases

78656421762

Manufacturer

Wiremold

Brand

Wiremold

RoHS

N

Series

pushPIN™

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

Top Mount

Subcategory

Wire & Cable Management

Attachment Method

Push Pin

Height Off Base (Height of Fin)

0.472 (12.00mm)

Thermal Resistance @ Forced Air Flow

6.37°C/W @ 100 LFM

Thermal Resistance @ Natural

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Power Dissipation @ Temperature Rise

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Product Category

a particular group of related products.

Conduit Fittings & Accessories

Width

2.362 (60.00mm)

Length

2.362 (60.00mm)

Diameter

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