Wintec Industries SLM2493

Mounting Type

Through Hole

Package / Case

40-DIP Module

Supplier Device Package

Module

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tray

Published

2012

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Data Format

A data format is the arrangement of data fields for a specific shape.

V.92