Winbond Electronics Corporation W74M32FVSSIQ

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

8

EU RoHS

Compliant

ECCN (US)

3A991b.1.a.

HTS

8542.32.00.71

Automotive

No

PPAP

No

Chip Density (bit)

32M

Block Organization

Symmetrical

Number of Bits/Word (bit)

8

Number of Words

4M

Programmability

Yes

Timing Type

Synchronous

Max. Access Time (ns)

7

Interface Type

Serial (SPI, Dual SPI, Quad SPI)

Minimum Operating Supply Voltage (V)

2.7

Typical Operating Supply Voltage (V)

3|3.3

Maximum Operating Supply Voltage (V)

3.6

Operating Current (mA)

30

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

Yes

ECC Support

No

Support of Page Mode

No

Minimum Endurance (Cycles)

100000

Mounting

Surface Mount

Package Height

1.8

Package Width

5.28

Package Length

5.28

PCB changed

8

Standard Package Name

SOP

Supplier Package

SOIC

Lead Shape

Gull-wing

Package Description

SOIC-8

Package Style

SMALL OUTLINE

Number of Words Code

4000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Reflow Temperature-Max (s)

NOT SPECIFIED

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

W74M32FVSSIQ

Clock Frequency-Max (fCLK)

80 MHz

Supply Voltage-Nom (Vsup)

3 V

Package Code

SOP

Package Shape

SQUARE

Manufacturer

Winbond Electronics Corp

Part Life Cycle Code

Active

Samacsys Description

Security ICs / Authentication ICs Security Authentication spiFlash, 3V, 32M-bit

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Risk Rank

2.36

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

NOR TYPE

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

GULL WING

Peak Reflow Temperature (Cel)

NOT SPECIFIED

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

1.27 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

8

JESD-30 Code

S-PDSO-G8

Supply Voltage-Max (Vsup)

3.6 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

2.7 V

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

SYNCHRONOUS

Architecture

Sectored

Organization

4MX8

Seated Height-Max

2.16 mm

Memory Width

8

Memory Density

33554432 bit

Parallel/Serial

SERIAL

Memory IC Type

FLASH

Programming Voltage

A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

3 V

Sector Size

4Kbyte x 1024

Page Size

256byte

Boot Block

No

Width

5.28 mm

Length

5.28 mm