Winbond Electronics Corporation W29N02GZSIBA

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

YES

Number of Terminals

63

EU RoHS

Compliant

ECCN (US)

3A991.b.1.a

HTS

8542.32.00.71

Automotive

Yes

PPAP

Unknown

Cell Type

NAND

Chip Density (bit)

2G

Block Organization

Symmetrical

Address Bus Width (bit)

29

Number of Bits/Word (bit)

8

Number of Words

256M

Programmability

Yes

Timing Type

Asynchronous

Maximum Erase Time (S)

0.01/Block

Maximum Programming Time (ms)

0.7/Page

Interface Type

Parallel

Minimum Operating Supply Voltage (V)

1.7

Typical Operating Supply Voltage (V)

1.8

Maximum Operating Supply Voltage (V)

1.95

Programming Voltage (V)

1.7 to 1.95

Operating Current (mA)

20

Program Current (mA)

20

Minimum Operating Temperature (°C)

-40

Maximum Operating Temperature (°C)

85

Supplier Temperature Grade

Industrial

Command Compatible

No

ECC Support

Yes

Support of Page Mode

Yes

Mounting

Surface Mount

Package Height

1

Package Width

18.4

Package Length

12

PCB changed

48

Supplier Package

TSOP

Supply Voltage-Nom (Vsup)

1.7V - 1.95V

Package Description

VFBGA,

Package Style

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Number of Words Code

256000000

Package Body Material

PLASTIC/EPOXY

Operating Temperature-Min

-40 °C

Operating Temperature-Max

85 °C

Rohs Code

Yes

Manufacturer Part Number

W29N02GZSIBA

Package Code

VFBGA

Package Shape

RECTANGULAR

Manufacturer

Winbond Electronics Corp

Part Life Cycle Code

Active

Ihs Manufacturer

WINBOND ELECTRONICS CORP

Risk Rank

2.31

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Type

SLC NAND Flash

Technology

CMOS

Terminal Position

BOTTOM

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

BALL

Number of Functions

1

Terminal Pitch

The center distance from one pole to the next.

0.8 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

48

JESD-30 Code

R-PBGA-B63

Supply Voltage-Max (Vsup)

1.95 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

INDUSTRIAL

Supply Voltage-Min (Vsup)

1.7 V

Speed

29MHz

Operating Mode

A phase of operation during the operation and maintenance stages of the life cycle of a facility.

ASYNCHRONOUS

Architecture

Sectored

Organization

High Quality Single Level Cell (SLC) Technology Standard ONFI NAND Command Set

Seated Height-Max

1 mm

Memory Width

8

Memory Density

2Gb

Parallel/Serial

PARALLEL

Memory IC Type

FLASH

Programming Voltage

A special high-voltage supply that supplies the potential and energy for altering the state of certain nonvolatile memory arrays. On some devices, the presence of VPP also acts as a program enable signal (P).

1.8 V

Sector Size

128Kbyte x 2048

Page Size

2Kbyte

Boot Block

No

Temperature

40ºC ~ 85ºC / -40ºC ~ 105ºC

Width

9 mm

Length

11 mm