W25Q32JWBYIQ TR

Winbond Electronics W25Q32JWBYIQ TR

Part No:

W25Q32JWBYIQ TR

Manufacturer:

Winbond Electronics

Datasheet:

W25Q32JW-SPI

Package:

12-UFBGA, WLCSP

ROHS:

AINNX NO:

1736117-W25Q32JWBYIQ TR

Category:

Memory

Description:

IC FLASH 32MBIT WLCSP

Products specifications
  • Factory Lead Time
    10 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    12-UFBGA, WLCSP
  • Memory Types
    Non-Volatile
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~85°C TA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series
    SpiFlash®
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Voltage - Supply
    1.7V~1.95V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    32Mb 4M x 8
  • Clock Frequency
    133MHz
  • Memory Format
    FLASH
  • Memory Interface

    An external memory interface is a bus protocol for communication from an integrated circuit, such as a microprocessor, to an external memory device located on a circuit board.

    SPI - Quad I/O
  • Write Cycle Time - Word, Page
    5ms
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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