Winbond ISD4002-150P

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Number of Terminals

28

Package Description

DIP, DIP28,.6

Package Style

IN-LINE

Package Body Material

PLASTIC/EPOXY

Package Equivalence Code

DIP28,.6

Operating Temperature-Max

70 °C

Manufacturer Part Number

ISD4002-150P

Package Code

DIP

Package Shape

RECTANGULAR

Manufacturer

Nuvoton Technology Corp

Part Life Cycle Code

Obsolete

Ihs Manufacturer

NUVOTON TECHNOLOGY CORP

Risk Rank

5.53

Part Package Code

DIP

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Subcategory

Audio Synthesizer ICs

Technology

CMOS

Terminal Position

DUAL

Terminal Form

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

THROUGH-HOLE

Terminal Pitch

The center distance from one pole to the next.

2.54 mm

Reach Compliance Code

compliant

Pin Count

a count of all of the component leads (or pins)

28

JESD-30 Code

R-PDIP-T28

Qualification Status

An indicator of formal certification of qualifications.

Not Qualified

Power Supplies

an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

3 V

Temperature Grade

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

COMMERCIAL

Supply Current-Max

40 mA

Consumer IC Type

SPEECH SYNTHESIZER WITH RCDG

Reading Time-Max

150 s

Lead Free

Contains Lead