W3H64M64E-400SBM
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68720309-W3H64M64E-400SBM
DDR DRAM, 64MX64, 0.6ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
The center distance from one pole to the next.
An indicator of formal certification of qualifications.
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.
A phase of operation during the operation and maintenance stages of the life cycle of a facility.
Distinct operation recognized by the protection mechanisms as a possible operation on an object.