W3H64M64E-400SBM

White Electronic Designs Corp W3H64M64E-400SBM

Part No:

W3H64M64E-400SBM

Package:

-

AINNX NO:

68720309-W3H64M64E-400SBM

Category:

Memory

Description:

DDR DRAM, 64MX64, 0.6ns, CMOS, PBGA208, 16 X 22 MM, 1 MM PITCH, PLASTIC, BGA-208

Products specifications
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Material
    synthetic polyolefin
  • Number of Terminals
    208
  • Rohs Code
    No
  • Part Life Cycle Code
    Transferred
  • Ihs Manufacturer
    WHITE ELECTRONIC DESIGNS CORP
  • Package Description
    BGA, BGA208,11X19,40
  • Access Time-Max
    0.6 ns
  • Clock Frequency-Max (fCLK)
    200 MHz
  • Number of Words
    67108864 words
  • Number of Words Code
    64000000
  • Operating Temperature-Max
    125 °C
  • Operating Temperature-Min
    -55 °C
  • Package Body Material
    PLASTIC/EPOXY
  • Package Code
    BGA
  • Package Equivalence Code
    BGA208,11X19,40
  • Package Shape
    RECTANGULAR
  • Package Style
    GRID ARRAY
  • Supply Voltage-Nom (Vsup)
    1.8 V
  • Diameter of protected wire (cable)
    21…39 mm
  • Diameter before shrinking
    41.5 mm
  • Diameter after shrinking
    20.0 mm
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    coil 50 m
  • Type
    Adhesive-free heat shrink tubing
  • Color
    red
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    AUTO/SELF REFRESH
  • Terminal Position
    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BALL
  • Peak Reflow Temperature (Cel)
    NOT SPECIFIED
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    1 mm
  • Reach Compliance Code
    unknown
  • Time@Peak Reflow Temperature-Max (s)
    NOT SPECIFIED
  • JESD-30 Code
    R-PBGA-B208
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)
    1.9 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    MILITARY
  • Supply Voltage-Min (Vsup)
    1.7 V
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Supply Current-Max
    1.2 mA
  • Organization
    64MX64
  • Output Characteristics
    3-STATE
  • Memory Width
    64
  • Standby Current-Max
    0.028 A
  • Memory Density
    4294967296 bit
  • I/O Type
    COMMON
  • Memory IC Type
    DDR2 DRAM
  • Refresh Cycles
    8192
  • Access Mode

    Distinct operation recognized by the protection mechanisms as a possible operation on an object.

    MULTI BANK PAGE BURST
  • Self Refresh
    YES
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