L083S222LF
SIP
44645423-L083S222LF
Res Thick Film NET 2.2K Ohm 2% 0.8W ±100ppm/C ISOL Conformal Coated 8-Pin SIP Pin Thru-Hole Bulk
Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.
The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.
The center distance from one pole to the next.
the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.
a particular group of related products.