WeEn Semiconductors BYQ30E-200,127

Mounting Type

Through Hole

Package / Case

TO-220-3

Surface Mount

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

NO

Diode Element Material

SILICON

Number of Elements

2

Operating Temperature (Max.)

150°C

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

JESD-609 Code

e3

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Number of Terminations

3

ECCN Code

EAR99

Terminal Finish

Tin (Sn)

Applications

ULTRA FAST SOFT RECOVERY POWER

Terminal Position

SINGLE

Reach Compliance Code

not_compliant

Base Part Number

BYQ30E-200

Reference Standard

IEC-60134

JESD-30 Code

R-PSFM-T3

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type

Standard

Current - Reverse Leakage @ Vr

30μA @ 200V

Voltage - Forward (Vf) (Max) @ If

1.25V @ 16A

Operating Temperature - Junction

150°C Max

Voltage - DC Reverse (Vr) (Max)

200V

Current - Average Rectified (Io)

16A

Number of Phases

1

Reverse Recovery Time

25ns

Rep Pk Reverse Voltage-Max

200V

JEDEC-95 Code

TO-220AB

Non-rep Pk Forward Current-Max

88A

Diode Configuration

1 Pair Common Cathode

Reverse Current-Max

30μA

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

RoHS Compliant