Wakefield-Vette 511-6U

Factory Lead Time

8 Weeks

Material

Aluminum

Shape

Rectangular, Fins

Package Cooled

Power Modules

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Series

511

Published

2007

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Type

Top Mount, Extrusion

Construction

FIN

Attachment Method

Adhesive

Height Off Base (Height of Fin)

2.410 61.21mm

Thermal Resistance @ Natural

0.65°C/W

Fin Orientation

LONGITUDINAL

Height

61.2mm

Length

6.000 152.40mm

Width

5.210 132.33mm

RoHS Status

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

ROHS3 Compliant

Lead Free

Lead Free