VPG Foil Y00891K50000TR13L

Mounting Type

Surface Mount

Mated Stacking Heights

4mm

Manufacturer

VPG FOIL RESISTORS

Series

Fine Mate

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tape & Reel (TR)

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Obsolete

Connector Type

Plug, Outer Shroud Contacts

Number of Positions

10

Number of Rows

2

Pitch

0.031 (0.80mm)

Contact Finish

Gold

Features

Board Guide, Solder Retention

Contact Finish Thickness

--

Height Above Board

0.106 (2.70mm)