VPG Foil RNC90Y5K9000FR

Mounting Type

Chassis Mount

Package / Case

HALF-PAK

Supplier Device Package

PRM1-1 (Half Pak Module)

Series

--

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Bulk

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Fast Recovery = 200mA (Io)

Diode Type

Schottky

Current - Reverse Leakage @ Vr

10mA @ 30V

Voltage - Forward (Vf) (Max) @ If

490mV @ 120A

Operating Temperature - Junction

-55°C ~ 150°C

Voltage - DC Reverse (Vr) (Max)

30V

Current - Average Rectified (Io)

120A

Capacitance @ Vr, F

7400pF @ 5V, 1MHz