Vishay Precision Group SS8PH10HM3_A/H

Mounting Type

Surface Mount

Package / Case

TO-277, 3-PowerDFN

Supplier Device Package

TO-277A (SMPC)

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other Names

SS8PH10HM3_A/HDKR SS8PH10HM3_A/HDKR-ND SS8PH10HM3_A/HGIDKR

Series

Automotive, AEC-Q101, eSMP®

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Original-Reel®

Moisture Sensitivity Level (MSL)

1 (Unlimited)

Speed

Fast Recovery = 200mA (Io)

Diode Type

Schottky

Current - Reverse Leakage @ Vr

2µA @ 100V

Voltage - Forward (Vf) (Max) @ If

900mV @ 8A

Operating Temperature - Junction

-55°C ~ 175°C

Voltage - DC Reverse (Vr) (Max)

100V

Current - Average Rectified (Io)

8A

Capacitance @ Vr, F

140pF @ 4V, 1MHz