V20D170C-M3/I

Vishay General Semiconductor - Diodes Division V20D170C-M3/I

Part No:

V20D170C-M3/I

Datasheet:

-

Package:

TO-263-3, D2Pak (2 Leads + Tab) Variant

AINNX NO:

28700592-V20D170C-M3/I

Description:

20A

Products specifications
  • Factory Lead Time
    8 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    TO-263-3, D2Pak (2 Leads + Tab) Variant
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Supplier Device Package
    TO-263AC (SMPD)
  • Diode Element Material
    SILICON
  • Number of Terminals
    2
  • Mfr
    Vishay General Semiconductor - Diodes Division
  • Product Status
    Active
  • Current - Average Rectified (Io) (per Diode)
    10A
  • Number of Elements per Chip
    2
  • Package Type
    TO-263AC
  • Rectifier Type
    Schottky Rectifier
  • Qualification
    -
  • Vr - Reverse Voltage
    170 V
  • Ir - Reverse Current
    150 uA
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 175 C
  • Unit Weight
    0.019401 oz
  • Minimum Operating Temperature
    - 40 C
  • Factory Pack QuantityFactory Pack Quantity
    2000
  • Mounting Styles
    SMD/SMT
  • Vrrm - Repetitive Reverse Voltage
    170 V
  • Manufacturer
    Vishay
  • Brand
    Vishay General Semiconductor
  • If - Forward Current
    20 A
  • RoHS
    Details
  • Ifsm - Forward Surge Current
    150 A
  • Package Style
    SMALL OUTLINE
  • Package Body Material
    PLASTIC/EPOXY
  • Operating Temperature-Min
    -40 °C
  • Operating Temperature-Max
    175 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    V20D170C-M3/I
  • Package Shape
    RECTANGULAR
  • Number of Elements
    2
  • Part Life Cycle Code
    Active
  • Ihs Manufacturer
    VISHAY INTERTECHNOLOGY INC
  • Forward Voltage-Max (VF)
    0.9 V
  • Risk Rank
    1.7
  • Series
    Automotive, AEC-Q101
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Applications
    EFFICIENCY
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    FREE WHEELING DIODE , LOW POWER LOSS
  • Subcategory
    Diodes & Rectifiers
  • Technology
    Si
  • Terminal Position
    SINGLE
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Reach Compliance Code
    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • JESD-30 Code
    R-PSSO-G2
  • Configuration
    Dual
  • Speed
    Fast Recovery =< 500ns, > 200mA (Io)
  • Diode Type
    Schottky
  • Current - Reverse Leakage @ Vr
    150 μA @ 170 V
  • Voltage - Forward (Vf) (Max) @ If
    900 mV @ 10 A
  • Case Connection
    CATHODE
  • Operating Temperature - Junction
    -40°C ~ 175°C
  • Output Current-Max
    10 A
  • Voltage - DC Reverse (Vr) (Max)
    170 V
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Schottky Diodes & Rectifiers
  • Number of Phases
    1
  • Rep Pk Reverse Voltage-Max
    170 V
  • JEDEC-95 Code
    TO-263AC
  • Non-rep Pk Forward Current-Max
    150 A
  • Diode Configuration
    1 Pair Common Cathode
  • Reverse Current-Max
    150 µA
  • Repetitive Peak Reverse Voltage
    170V
  • Reverse Test Voltage
    170 V
  • Product
    Schottky Rectifiers
  • Vf - Forward Voltage
    830 mV
  • Product Category

    a particular group of related products.

    Schottky Diodes & Rectifiers
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