Vishay General Semiconductor - Diodes Division FEP30FP-E3/45

Mounting Type

Through Hole

Package / Case

TO-3P-3, SC-65-3

Supplier Device Package

TO-247AD (TO-3P)

Current - Average Rectified (Io) (per Diode)

15A

Base Product Number

FEP30

Packaging

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Tube

Part Status

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Active

Speed

Fast Recovery =< 500ns, > 200mA (Io)

Current - Reverse Leakage @ Vr

10 µA @ 300 V

Voltage - Forward (Vf) (Max) @ If

1.3 V @ 15 A

Operating Temperature - Junction

-55°C ~ 150°C

Voltage - DC Reverse (Vr) (Max)

300 V

Diode Configuration

1 Pair Common Cathode

Reverse Recovery Time (trr)

50 ns